The report contains ten-year analysis with the following sections
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sidense corporation | 200 |
synopsys | 2 |
winpak heat seal packaging | 1 |
sidence corporation | 1 |
sidense corporation | 20 |
sidense corporation | 4 |
synopsys | 2 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
mask programmable anti-fuse architecture | 41 | 2006 |
high speed otp sensing scheme | 21 | 2004 |
low threshold voltage anti-fuse device | 16 | 2008 |
test circuit for an unprogrammed otp memory array | 13 | 2008 |
redundancy system for non-volatile memory | 12 | 2009 |
anti-fuse memory cell | 12 | 2004 |
redundancy system for non-volatile memory | 11 | 2009 |
anti-fuse memory cell | 10 | 2004 |
high reliability otp memory | 8 | 2009 |
a reverse optical proximity correction method | 8 | 2004 |