The report contains ten-year analysis with the following sections
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unimicron technology corporation | 110 |
Title of patent family (most common patent title) |
Family members |
Filing year |
---|---|---|
manufacturing method of circuit board and stamp | 14 | 2016 |
packaging substrate having embedded through-via interposer and method of fabricating the… 🛈 | 13 | 2011 |
interposed substrate and manufacturing method thereof | 11 | 2012 |
through-holed interposer, packaging substrate, and methods of fabricating the same | 10 | 2012 |
circuit board and manufacturing method thereof | 9 | 2010 |
circuit board structure and manufacturing method thereof | 9 | 2015 |
method of fabricating packaging substrate having a passive element embedded therein | 8 | 2010 |
packaging substrate having through-holed interposer embedded therein and fabrication met… 🛈 | 8 | 2010 |
embedded structure and method for making the same | 8 | 2008 |
a circuit board | 8 | 2007 |